Generate MRD/PRD based on user needs, competitor analysis; define hardware specs, OS, target cost. Key deliverables: PRD, project charter, preliminary BOM.
Schematic design, PCB layout, embedded software development, mechanical 3D modeling. EVT, DVT, PVT pilot run. Outputs: Gerber, firmware, final BOM.
Components (active/passive), PCB, display, battery, enclosure molding. IQC per IPC-7351, full dimension/electrical sampling. Material bound with unique 2D code.
Fully automatic solder printing, SPI, high-speed placement, reflow profile control. Inline AOI+AXI solder inspection; first article approval before mass production. ESD全程监控.
Final assembly (display, battery, enclosure), air-tight test, camera/audio calibration; 48h dynamic burn-in chamber; final functional test (FCT).
Service desk receives defect report → RMA entry → failure analysis → repair/replace → re-test OK → re-warehouse/return to customer. Critical defects: disassemble reusable parts back to raw material warehouse, closing the loop.